Rogers, Connecticut, August 15, 2007: Rogers Corporation (NYSE:ROG) today announced the company has licensed a highly compliant thermal interface material technology from International Business Machines (IBM). This technology is used in high performance and high reliability chip packaging applications where heat management becomes a limiting factor. Rogers plans to integrate this product line into its Thermal Management Solutions family of products. Robert C. Daigle, Rogers Vice President of R&D and Chief Technology Officer, stated, “We are pleased to add this technology to our thermal management portfolio. Products based on this technology will become an essential part of Rogers’s strategy of being a solutions provider for our thermal management customers. While searching for thermal interface material technologies, it became clear that IBM had developed a truly unique, high performance material set and we feel confident we can turn this into a commercial success.” Safe Harbor Statement Statements in this news release that are not strictly historical may be deemed to be “forward-looking” statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s current expectations and are subject to the many uncertainties that exist in the Company’s operations and environment. These uncertainties, which include economic conditions, market demand and pricing, competitive and cost factors, rapid technological change, new product introductions, legal proceedings, and the like, are incorporated by reference in the Rogers Corporation 2005 Form 10-K filed with the Securities and Exchange Commission. Such factors could cause actual results to differ materially from those in the forward-looking statements. All information in this press release is as of August 15, 2007, and Rogers undertakes no duty to update this information unless required by law. Rogers Corporation, headquartered in Rogers, CT, U.S.A., develops and manufactures high-performance specialty material based products, which serve a diverse range of markets including: portable communication devices, communication infrastructure, consumer products, computer and office equipment, ground transportation, and aerospace and defense. Rogers operates manufacturing facilities in Connecticut, Arizona, and Illinois in the U.S., in Gent, Belgium, and in Suzhou, China. Sales offices are located in Belgium, Japan, Taiwan, Korea, China, and Singapore.