ARLON’s new MultiClad™ HF is the next generation of halogen-free, low-loss thermoset and prepreg system for high-speed and high-frequency multilayer printed circuit boards. MultiClad HF is a thermally robust, high durability system with a high Tg (205° by DSC), low Z-direction expansion (1.2 percent from 50° to 260°C) and high decomposition temperature >350°C that meets industry lead-free standards. With competitive insertion loss and Loss Tangent (Df<0.005 at 10 GHz), MultiClad HF® is designed for high-speed backplanes and server boards, power amplifiers, satellite receivers, LNB converters, as well as semiconductor burn-in-boards and other high speed, high reliability applications.
