Items Tagged with 'Wi-Fi 6/6E'

Infineon Technologies AG announced the company is extending its AIROC™ portfolio with the AIROC CYW5551x Wi-Fi 6/6E and Bluetooth® 5.4 solution. 

LitePoint announced it is collaborating with chipset maker MediaTek to deliver turnkey design validation test solutions for MediaTek’s Wi-Fi 6/6E Filogic chips, enabling customers to simplify and speed test results for this new family of high performance connectivity chipsets.

Infineon Technologies AG's newly developed AIROC™ brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC.