Items Tagged with 'chips'

Sivers Semiconductors received another order in the lower thousands of units from its Tier-1 5G infrastructure customer for beamformer and up-/down-converter chips that will be used in the next product prototype build by the customer. 

LitePoint announced its collaboration with global technology leader Broadcom Inc. to ensure performance and accelerate verification of access points based on Broadcom’s new Wi-Fi 7 chips. 

University of Glasgow engineers have scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems.

Qorvo®, a leading provider of innovative RF solutions that connect the world, and Levarys, a leading developer and manufacturer of smart thermostat solutions, announced that Levarys’ new Luna Smart Home System for energy management includes ZigBee chips from Qorvo’s Low Power Wireless business (formerly GreenPeak Technologies).

By the end of 2016, more than half of all new automotive 77 GHz radar systems will be equipped with chips from Infineon Technologies. Thus, one in 15 new cars will use a driver assistance system utilizing the company’s 77 GHz radar chips.

 Infineon Technologies AG  announced that it has shipped its ten millionth high-frequency radar chip. The 77-GHz chips are used in radar-based driver assistance systems that recognize objects at ranges of up to 250 meters. Infineon estimates that in the year 2014 nearly 50 percent of 77-GHz radar systems in vehicles were equipped with Infineon technology. 

Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs) and Semico Research, a semiconductor marketing and consulting research company, announced that they have teamed up to launch Boards, Chips and Packaging: Designing to Maximize Results. This new industry event will span the system-level ecosystem to address the roles of system architecture, board design, chip design, package design and final fabrication and assembly processes for hardware product development.

Anokiwave Inc., an innovator and leading supplier of semiconductors enabling mmW and AESA markets, announced the completion of a Series B round of funding. The round was led by Mr. JP Carney, CEO and co-founder of Revolabs, Dr. Lamberto Raffaelli, and COM DEV International Ltd. Anokiwave will use the funds to continue to expand its engineering team, launch development laboratory facilities and expand rapidly innovative products for mmW 5G and complementary markets.