We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Sivers Semiconductors announced that it has signed a contract to develop high performance, low-cost digitizers based on the NXP Layerscape platform for satcom by Intelsat.
Sivers Semiconductors announced that it has successfully signed contracts for both the electronic warfare and 5G/6G chip development awards with the Northeast Microelectronics Coalition (NEMC) Hub through the U.S. CHIPS and Science Act.
Sivers Semiconductors announced receiving first-year funding of $5.6 million from the Northeast Microelectronics Coalition (NEMC) Hub through U.S. CHIPS and Science Act under the Microelectronics Commons program to develop full-duplex arrays for EW.
Sivers Semiconductors announced receiving first-year funding of $6 million from the Northeast Microelectronics Coalition (NEMC) Hub through U.S. CHIPS and Science Act under the Microelectronics Commons Program.
Sivers Semiconductors AB announced that the Company has entered into a non-binding letter of intent (LOI) to merge its Sivers Photonics Ltd subsidiary with byNordic Acquisition Corporation.
Sivers Semiconductors AB (Sivers) announced the appointment of Vickram Vathulya as its new president and CEO, succeeding Anders Storm, effective August 19, 2024.
Under a new contract with Blu Wireless, Sivers Semiconductors will design and develop advanced 5G long range antenna modules that operate within the 57 to 71 GHz license exempt band.
Sivers Wireless has signed a third product development agreement with its lead European Satellite Company to develop next-generation production-ready beamformer chipsets.
Sivers Semiconductors AB announced the commercial launch of its state-of-the-art new low-cost RF module BFM02803, covering the 5G frequency range 2 mmWave bands N257, N258 and N261 (from 24.25 to 29.5 GHz).
