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Texas Instruments announced it would receive up to $1.6 billion in funding from the U.S. Commerce Department towards the construction of three new facilities, the latest government outlay aimed at bolstering domestic chip production.
Texas Instruments (TI) announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions.
Xilinx, Inc. announced a collaboration with Texas Instruments (TI) to develop scalable and adaptable digital front-end (DFE) solutions to increase energy efficiency of lower antenna count radios.
