Items Tagged with 'StratEdge Corporation'

StratEdge Corporation announced that it will be exhibiting in booth 923B at EuMW and booth 313 at IMAPS International Symposium for Microelectronics.

StratEdge Corporation announces its capabilities for making hybrid packages used in legacy applications where redesigns are difficult or impossible. 

StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including EuMW. 

StratEdge Corporation will display its thermally-efficient packages at CS MANTECH at booth 17. 

To support the roll-out of 5G base stations, StratEdge Corporation has expanded its production line and capacity for ceramic and molded ceramic packages, projecting run rates will exceed 100,000 packages.