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Indium Corporation® will feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan, including its GalliTHERM™ portfolio of Ga-based liquid metal solutions.
IDTechEx’s recent research into Thermal Management for 5G has found innovations occurring within the semiconductor technology (CMOS, SiGe, GaN, etc.), thermal interface materials and die attach technology.
Thanks to TIM and Ericsson’s deployment of a 5G network at Comau’s headquarters in Turin, Italy, three new applications have been launched to demonstrate the advantages of the new technology within an industrial environment.
TIM, Ericsson and Qualcomm Technologies, Inc. are leaders once again with a new record for ultrabroadband long distance speed with 5G technology applied to Fixed Wireless Access (FWA).
Henkel announced the launch of a new gel thermal interface material (TIM) that can withstand the environmental and positioning demands of today’s infrastructure components.
