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Fabio Cavaliere and Antonio D'Errico released their title, Photonic Applications for Radio Systems Networks, from Artech House. Keep reading to learn more about why they wrote this book, and how they hope the book will help to shape the future of 5G networks.
DuPont Electronics & Imaging and SCHMID Group announce that they have entered into a nonexclusive joint development agreement to explore new PCB plating applications to bring advanced innovations to our global customers. The partnership will benefit high-end printed circuit board manufacturers by delivering next-generation interconnect products and metallization processes that can create faster, smarter and more reliable devices for the 5G era. The new solutions which will include equipment and chemistry are expected to be launched in late 2020.
Last night, at EDI CON China 2018 the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.
NI, the provider of solutions that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the opening of the new NI Industrial IoT Lab at its Austin,Texas headquarters.
Analog Devices Inc. (ADI) announced that the company has been honored with the 2017 IEEE Corporate Innovation Award “for sustained innovation and leadership in the development of high-performance data converter technology and products.” This award was established in 1985 to recognize outstanding innovation by organizations across the world, and recipients are honored for their resolve to discover, extend, or complement technological advancements in education, industry, research and service in IEEE fields of interest.
EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its Measurement Track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone.
Keysight Technologies Inc. announced new collaborations with China Mobile on key 5G technologies. This includes channel measurement and modeling and massive MIMO over-the-air (OTA) testing.
Averna, an industry-leading provider of test solutions and services for communications and electronics device-makers worldwide, announced the opening of an RF and FPGA Innovation Lab at its U.S. Headquarters in Atlanta.
Ericsson has opened registration for the Ericsson Innovation Awards (EIA) 2016, a global competition that gives students the opportunity to develop innovative ideas in collaboration with Ericsson experts.
Ericsson announces the expansion of its cross-industry 5G research and development (R&D) program to a range of European markets. The 5G for Europe program will bring together major industrial players, the public sector and leading universities across Europe to strengthen the continent's competitiveness and maximize the benefits of the Networked Society.
NI, the provider of solutions that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the opening of the new NI Industrial IoT Lab at its Austin,Texas headquarters.
EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its Measurement Track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone.