Items Tagged with 'NXP Semiconductors N.V.'

NXP Semiconductors N.V. announced the availability of its second generation of comprehensive Airfast RF power multi-chip modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements for cellular base stations.

NEC Corporation has selected NXP® Semiconductors to supply RF Airfast multi-chip modules for a massive MIMO 5G antenna radio unit for Rakuten Mobile, one of Japan’s mobile network operators.

NXP Semiconductors N.V. announced its family of 2x2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE solutions that are driving a new phase of connectivity innovation for advanced gaming, audio, industrial and IoT markets.

NXP Semiconductors N.V. announced that the first multi-device vehicle wireless charging solution driven by a single MWCT controller is now available in production vehicles.

NXP Semiconductors N.V. announced that NXP’s secure ultra-wideband (UWB) fine-ranging solution, embedded SIM (eSIM) as well as near field communication and secure element (eSE) unit are deployed in Samsung’s new Galaxy Note20 Ultra.

NXP Semiconductors N.V. announced the availability of a comprehensive Wi-Fi 6 (802.11ax) portfolio, which significantly expands the number of products and markets able to adopt the latest Wi-Fi standards. NXP’s expanded Wi-Fi 6 portfolio represents the company’s new end-to-end vision and differentiated technology approach that is designed to help usher in an era of connectivity innovation for automotive, access, mobile and industrial and IoT markets.