Zentech Manufacturing is pleased to announce the addition of the Nordson DAGE Xi3400 AXI system. If your product design utilizes Bottom Terminated Components (BTC), such as BGA's, uBGA's, QFN's and LGA's — these components cannot be adequately inspected after assembly without 3D X-Ray.
Zentech Manufacturing is pleased to announce the addition of the Nordson DAGE xi3400 AXI system. This new Nordson DAGE AXI system offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for both in-line or off-line operation, the Xi3400’s innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.