Items Tagged with 'chemistry'

DuPont Electronics & Imaging and SCHMID Group announce that they have entered into a nonexclusive joint development agreement to explore new PCB plating applications to bring advanced innovations to our global customers. The partnership will benefit high-end printed circuit board manufacturers by delivering next-generation interconnect products and metallization processes that can create faster, smarter and more reliable devices for the 5G era. The new solutions which will include equipment and chemistry are expected to be launched in late 2020.

Indium Corp.’s Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper "Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly" at the opening ceremony of the IPC APEX Expo on March 25.