Items Tagged with 'build'

COMSOL, the leading provider of multiphysics modeling, simulation, and application design software, announced support for app development in the latest version of LiveLink™ for SOLIDWORKS®. Part of COMSOL Multiphysics® software, the only fully integrated environment for creating custom simulation applications, LiveLink™ for SOLIDWORKS® connects COMSOL® software simulations and 3D design and its latest version allows users to build apps with the Application Builder. 

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies.