Items Tagged with 'coolspan'

 Rogers Corp. will be showing some of its high-performance electronic printed-circuit-board (PCB) materials and offering advice on optimum ways to use them at the upcoming PCB West Exhibition (http://pcbwest.com), September 10, 2014, at the Santa Clara Convention Center, Santa Clara, Calif. 

Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.

Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.

Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.