Items Tagged with 'plating'

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.

Michael Casper, president and CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that they have developed a high density (HD) thin film based ENEPIG process that now combines low cost sputtering, traditional thin film photolithography and etching, and plating with ENEPIG.