Items Tagged with 'compound'

WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry,announced the expansion of its GaN technology portfolio with addition of the NP45 gallium nitride on silicon carbide process. NP45 is a 0.45μm-gate MMIC technology enabling users to design fully integrated amplifier products as well as custom discrete transistors, and has been optimized for use in 4G macro-cell base station power amplifiers operating at 2.7 GHz and above where bandwidth and linearity performance are key differentiators.

Wolfspeed, a Cree Company and a leading global supplier of GaN-on-SiC high electron mobility transistors (HEMTs) and monolithic microwave integrated circuits (MMICs), is exhibiting, chairing the Analog, RF, and Microwave subcommittee, and celebrating the 15th anniversary of the first GaN MMIC at the 2015 IEEE Compound Semiconductor IC Symposium (CSICS), which will take place October 11–14, 2015 in New Orleans.

WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced that it has surpassed 1 million cumulative wafer shipments to customers in the mobile PA, Wi-Fi, wireless infrastructure and optical markets.

Northrop Grumman Corp. announced its participation in three Phoenix, Arizona-area conventions focused on microwave and semiconductor technology.

 Accel-RF Instruments Corp., the worldwide leader in turn-key reliability and performance characterization test Systems for compound semiconductors, announces its participation in the upcoming ESREF Exhibition in Berlin, Germany. The ESREF conference will take place September 29 through October 2 at the Technische Universität Berlin (TUB). 

MACOM announced an IP licensing program for Gallium Nitride (GaN) on silicon technology.  MACOM detailed recent progress in two areas critical to realizing its future vision of enabling the mainstream adoption of GaN as a large-scale RF semiconductor technology across the industry.

Premix, the leading specialist in conductive plastics, launches the PREPERM® product family with customizable dielectric properties for high-frequency applications. The new product range provides high-frequency device manufacturers with an outstanding material that maximizes performance without increasing overall costs. PREPERM grades can be cost-effectively injection molded to high frequency antenna parts.