Items Tagged with 'bonder'

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Hesse Mechatronics to demonstrate wedge wire bonding capabilities at Productronica

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.


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Hesse & Knipps opens demo and applications lab on west coast

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, a manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region.
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