We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Rohde & Schwarz is addressing the demands for characterizing wideband components and systems with the R&S FSW-B5000 option, which will be demonstrated for the first time to at EDI CON USA in Boston.
Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products.
Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.
Custom MMIC, a leading developer of performance driven monolithic microwave integrated circuits (MMICs) is pleased to announce Dr. Charles J. Trantanella, Chief Scientist at Custom MMIC, will be presenting at EDI CON USA 2016 on September 22 with his talk at 9:00 a.m. entitled, “Reaching New Heights in Mixer Linearity with GaN MMIC Technology.”
Berkeley Nucleonics, an innovator in in Microwave Signal Generation & Analysis instrumentation, will be showcasing its products at EDI CON USA in Boston, Mass., September 20-22, 2016.
EDI CON USA 2016 is pleased to announce that James Komiak, Ph.D., renowned amplifier expert and Global Engineering/Scientific Fellow at BAE Systems, will be kicking off the conference’s amplifier track on Tuesday September 20 at 9:30 a.m. with a keynote talk. Taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, the EDI CON USA conference and exhibition brings together engineers working on high-frequency analog and high-speed digital designs for learning and networking opportunities.
EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its Measurement Track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone.
EDI CON China 2016 set new records for attendance and sponsorship, with more than 3,100 unique attendees — including 1,855 delegates. Attendance grew by 35 percent, and the exhibition grew by 32 percent, making it the largest RF/microwave, EMC/EMI and high-speed digital design event in China.
Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 
Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.
EDI CON USA 2016 is pleased to announce that James Komiak, Ph.D., renowned amplifier expert and Global Engineering/Scientific Fellow at BAE Systems, will be kicking off the conference’s amplifier track on Tuesday September 20 at 9:30 a.m. with a keynote talk. Taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, the EDI CON USA conference and exhibition brings together engineers working on high-frequency analog and high-speed digital designs for learning and networking opportunities. 
EDI CON China 2016 set new records for attendance and sponsorship, with more than 3,100 unique attendees — including 1,855 delegates. Attendance grew by 35 percent, and the exhibition grew by 32 percent, making it the largest RF/microwave, EMC/EMI and high-speed digital design event in China.