Items Tagged with 'substrate'

Coupling Wave Solutions S.A. (CWS), a leader in solutions for interference analysis in complex chip designs incorporating RF and analog blocks, announced the availability of a new productivity tool called SiPEX. SiPEX models the silicon substrate on insulators much faster than any other tools in its class and allows radio frequency (RF) silicon-on-insulator (SOI) designers to increase the number of design iterations—including spice simulation—up to 10 times in the same time frame.

 AVX Corp., a leading manufacturer of passive components and interconnect solutions, has expanded its partnership with Modelithics, the leading RF/Microwave simulation model provider, with the addition of 45 new Modelithics® substrate scalable equivalent circuit models.  

TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,558,556, “Planar-axial thermistor for bolometry.” This patent describes a novel way to construct very small planar thermistors on a substrate with very low heat transfer. The thermistors are more thermally isolated from the environment than are commercially-produced thermistors. Both the small size and thermal isolation make them useful for measuring RF power at microwave frequencies up to 70 GHz.

Modelithics Inc. welcomed Syfer to the Modelithics Vendor Partner (MVP) Program. Syfer and Modelithics have collaborated to develop a Microwave Global Model™ for Syfer’s 0603 case-size High Q Ultra-Low ESR capacitor family. These simulation models are substrate scalable, part-value scalable, pad scalable, and orientation selectable (vertical or horizontal surface-mount).

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”. 

Proposes a substrate integrated waveguide bandpass filter that uses proximity coupling structures and slot loaded quarter SIW resonators to implement a CT filter

Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, announced it has more than doubled production of bonded silicon-on-sapphire (BSOS) substrates to meet increased demand from its strategic partner, Peregrine Semiconductor Corp. (NASDAQ: PSMI). Peregrine Semiconductor, a fabless provider of high-performance radio frequency integrated circuits (RFICs), has increased peak-production capability of its latest-generation STeP5 UltraCMOS® technology-based RF switches to more than two million units a day, to support design wins in the Radio Frequency Front Ends (RFFEs) of today’s most advanced 4G smart phones, and other wirelesscommunication applications.