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Rohde & Schwarz is showcasing its contribution to state-of-the-art research for next-generation wireless technologies at European Microwave Week in Paris.
Mercury Systems, Inc. announced an agreement with the U.S. Navy to develop manufacturing capabilities that would allow commercial photonics chiplets to accelerate edge processing in defense applications.
Rohde & Schwarz and Zurich Instruments will present advanced test and measurement solutions for photonics at the LASER World of PHOTONICS tradeshow in Munich.
I-PEX and Teramount Ltd announced they are collaborating to advance Si photonics optical detachable connectivity for data centers and for other high speed datacom and telecom applications.
Synopsys, Inc. and Juniper Networks announced that they have closed a transaction to form a new, separate company that will provide the industry with an open Si photonics platform to address the growing photonic requirements.
Fabio Cavaliere and Antonio D'Errico released their title, Photonic Applications for Radio Systems Networks, from Artech House. Keep reading to learn more about why they wrote this book, and how they hope the book will help to shape the future of 5G networks.
Preetpaul Singh Devgan's book, Applications of Modern RF Photonics, presents applications of modern RF photonic systems that use RF photonic components for commonly used signal processing systems. In this post, he explains what he hopes readers get out of his book.
Optoelectronic industry designers have traditionally used discrete optical devices for transceiver designs. The process requires manual integration of discrete free-space optical components such as lasers, modulator, photo detectors, isolators, MUX/DE-MUX, lenses in the form of optical gold box sub-assemblies such as transmit optical sub-assembly (TOSA).
Computer Simulation Technology and VPIphotonics announced their partnership to couple full-wave photonic device simulation and overall circuit simulation and analysis of integrated photonic components and subsystems within a single framework.
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.