Items Tagged with 'automatic'

As the 200 mm wafer test market continues to expand, MPI Corp. is introducing a new fully automatic wafer probe system. The TS2500-RF addresses multiple production test market requirements which include radio frequency (RF) communication devices and discrete passive components.

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 

SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, is announcing its full-service, high-quality, RF/Microwave design and automated assembly services as a viable option for companies looking to reduce assembly cost while keeping their production domestic.

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.

AMETEK Programmable Power, the global leader in programmable AC and DC power test solutions, announces that its ReFlex Power™ (RFP) System is now qualified for use in standard Department of Defense (DoD) Automated Test Systems (ATS) across all major military branches.

Redline Communications (www.rdlcom.com) Group Inc., a leading provider of broadband wireless solutions for industrial machine-to-machine (M2M) communications, announced the availability of the RAS Smart Antenna System. The solid state RAS is the first wireless broadband networking system that instantly locates, steers toward and connects to a network base station, automatically establishing reliable high speed connectivity to and from roving assets.