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Fairview Microwave announced the launch of its high-power RF terminations to enhance signal integrity in demanding applications across telecommunications, aerospace and defense sectors.
Optoelectronic industry designers have traditionally used discrete optical devices for transceiver designs. The process requires manual integration of discrete free-space optical components such as lasers, modulator, photo detectors, isolators, MUX/DE-MUX, lenses in the form of optical gold box sub-assemblies such as transmit optical sub-assembly (TOSA).
The electronica trade fair will be held November 8-11, 2016, in Munich. Rohde & Schwarz will present its portfolio of T&M solutions tailored to the requirements of today's most significant technology trends (hall A1, booth 307).
Design engineers dealing with electromagnetic compatibility (EMC) and signal integrity (SI) of PCBs, can now employ CST BOARDCHECK™ to get a quick overview of potential problems in their layout.
Jon Martens of Anritsu and Al Neves of Wild River Technology used DesignCon 2012 to discuss high-confidence S-parameter measurement methodologies for 15 - 28 Gbpsec.
Design engineers dealing with electromagnetic compatibility (EMC) and signal integrity (SI) of PCBs, can now employ CST BOARDCHECK™ to get a quick overview of potential problems in their layout.
Jon Martens of Anritsu and Al Neves of Wild River Technology used DesignCon 2012 to discuss high-confidence S-parameter measurement methodologies for 15 - 28 Gbpsec.
Comparison of an RF/microwave engineer versus an SI engineer and how both stand to benefit from the upcoming DesignCon show