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Sivers Semiconductors announced receiving first-year funding of $5.6 million from the Northeast Microelectronics Coalition (NEMC) Hub through U.S. CHIPS and Science Act under the Microelectronics Commons program to develop full-duplex arrays for EW.
Sivers Semiconductors announced receiving first-year funding of $6 million from the Northeast Microelectronics Coalition (NEMC) Hub through U.S. CHIPS and Science Act under the Microelectronics Commons Program.
The Biden-Harris Administration announced that the U.S. Department of Commerce and GlobalWafers America, LLC and MEMC LLC, subsidiaries of GlobalWafers Co., Ltd. have signed a non-binding PMT to provide up to $400 million in proposed direct funding under the CHIPS and Science Act.
The Biden-Harris Administration announced that the U.S. Department of Commerce and Amkor Technology, Inc. have signed a non-binding PMT to provide up to $400 million in proposed direct funding under the CHIPS and Science Act.
As the first funding announcement as part of the CHIPS and Science Act, the U.S. Department of Commerce has announced approximately $35 million in initial funding for BAE Systems to modernize the Microelectronics Center in Nashua, N.H.
To meet CHIPS Act goals and as a resource for semiconductor plants, ARISTA has created a Longevity Task Force, focused on increasing the longevity of wafer fabrication tools to optimize production and increase productivity.
Leaders from industry, government and academia convened at a summit on April 18 in Washington, D.C., to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
Passage of the CHIPS for America Act, now signed into law by President Joe Biden, will provide more than $52 billion to invest in domestic U.S. chip manufacturing and research.