StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).
MicroGen Systems announced that vibration energy harvesting BOLT™ Power Cells enabled a live wireless sensor network (WSN) using Linear’s Dust Networks LTC5800-IPM SmartMesh™ IP mote-on-chip at the Sensors Expo and Conference exhibition in Rosemont, IL on June 5-6, 2013.