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Microchip Technology has expanded its Bluetooth Low Energy portfolio with 12 new products, aimed at providing designers with an extensive array of choices to tackle their unique challenges.
Renesas Electronics Corporation introduced the DA14592 Bluetooth® LE SoC representing Renesas’ lowest power consumption and smallest, multi-core Bluetooth LE device.
u-blox has announced u-blox IRIS-W1, the first compact stand-alone Wi-Fi module combining dual-band Wi-Fi 6, Bluetooth® LE 5.3 and Thread including support for Matter.
Murata launched its newest Bluetooth® LE module, the Type 2EG. Based on the RSL15 secure Bluetooth 5.2 MCU from onsemi, the product delivers a fully certified, secured, ultra-small Bluetooth LE solution.
Renesas Electronics Corporation announced its first development kit that includes support for the new Matter protocol and Matter support on all future Wi-Fi, Bluetooth Low-Energy and IEEE 802.15.4 (Thread) products.
The Bluetooth Special Interest Group (SIG) announced a new specification development project to define the operation of Bluetooth LE in additional unlicensed mid-band spectrum, including the 6 GHz frequency band.
Renesas Electronics Corporation announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth® LE low-power, near-field communication standard.
Infineon Technologies AG is launching the AIROC™ CYW20829 Bluetooth® LE SoC, a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications.
