Items Tagged with 'nodes'

Siklu announced that its Terragraph-certified MultiHaul™ TG N366 nodes and companion MultiHaul™ TG terminal units have been deployed by Horizon Communications of Hamilton, Bermuda.  

L-3 and Lemko Corp.  flew an ultra-light airborne 4G LTE SwarmNetwork for tactical air to ground broadband communications. The X5 aerial demonstration proved that the same high-speed data infrastructure available in fixed mounted or dismounted configurations on the ground can be further supported from the air. Lemko's solution surpasses traditional LTE coverage bubbles by the ODC SwarmNetwork providing an ad-hoc LTE network with roaming, hand-off and survivability between nodes.

Mobile Experts released a new five-year forecast for Distributed Antenna Systems. The Mobile Experts forecast projects rapid growth for DAS deployment, with the number of DAS nodes deployed doubling between 2013 and 2016. More than 50% of DAS networks will include small cells and Wi-Fi by 2018.

DARPA is exploring new technologies unencumbered by Internet Protocols (IP) that could be the key to enabling large MANETs.

RF Monolithics Inc. (a subsidiary of Murata Electronics North America Inc.) (“RFM” or “the company”), a provider of solutions-driven, technology-enabled RF technologies for machine-to-machine (M2M) and wireless communications, introduced the next generation of its wireless sensor networking platform products -- the SN-4 series of battery-powered wireless sensor nodes. The SN-4 provides 4 channels of sensor inputs and transmits the data back to access points, Ethernet, or Cellular gateways.

Ericsson has been contracted to deliver mobile backhaul to Polska Telefonia Cyfrowa S.A. (PTC), the operator arm of the T-Mobile brand in Poland.

Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.