Items Tagged with 'chip terminations'

The XMWT80L1G is a flip-chip, surface-mountable 50 Ω termination with a power rating of 0.5 Watts (average) and a peak-to-average ratio of 12 dB.

Smiths Interconnect extends its offering of high frequency wire-bondable chip terminations with the release of its new HR-CTX Series, a small, easy-to-implement, high-reliability product qualified for space applications.