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STMicroelectronics and GlobalFoundries Inc announced they have signed a Memorandum of Understanding to create a new, jointly operated 300 mm semiconductor manufacturing facility.
CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI technology.
Acorn Technologies is funding a research project led by Professor Raskin to assess and quantify the performance potential of the company’s Acorn Buried Stressor (ABS) technology for RF semiconductor manufacturing.
