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Rogers Corporation will exhibit at PCB West in Santa Clara, Calif., (booth #201) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials.
Rogers Corporation announced they will be showcasing its products in booth 1635 and Technical Marketing Manager John Coonrod will give two presentations June 14 in the MicroApps Theater at IMS2023 in San Diego, Calif.
Rogers Corporation will exhibiting their family of thin laminates and bonding materials, along with Radix™ 3D Printable Dielectrics,
at the Del Mar Electronics & Manufacturing Show April 26 – 27 in San Diego, Calif., at booth 622.
Rogers Corporation will exhibit its advanced material solutions for Aerospace & Defense markets at the Defense TechConnect Summit & Expo 2022, Booth # 513, in National Harbor, Md., Sept. 27 – 28, 2022.
Rogers Corporation will exhibit at PCB West in Santa Clara, Calif. (booth #201) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials.
Rogers Corporation announced it will be exhibiting, plus Technical Marketing Manager, John Coonrod, will give three presentations June 21 in the MicroApps Theater, at the International Microwave Symposium (IMS) in Denver.
Rogers Corporation will exhibit at the GOMACTech 2022 Conference, March 21-24 in Miami, Fla. (Booth #808), highlighting its industry-leading advanced copper clad laminate solutions, primarily the RT/duroid® series, used in C4ISR applications.
Rogers Corporation announced that it has entered into a definitive merger agreement to be acquired by DuPont in an all-cash transaction that values Rogers at approximately $5.2 billion.