Items Tagged with 'materials'

Rogers Corporation will exhibit at PCB West in Santa Clara, Calif., (booth #201) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials.

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.

Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.

Rogers Corp. is exhibiting at the 2016 IEEE MTT-S International Microwave Symposium (IMS) May 24-26, at the Moscone Center in San Francisco, Calif., Booth #2039. IEEE MTT-S IMS is the microwave industry’s largest international gathering of RF/microwave professionals, with over 600 exhibition booths and more than 8,000 attendees expected.

Research, development, innovation and training are the focus of the new Innovation Hub project framework agreement between Finmeccanica and the Politecnico of Milan, Italy.

Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid^® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.

Indium Corp. will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, held on March 15-17 in Las Vegas, Nev. 

Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.