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Smiths Interconnectannounces the release of the Volta Series probe heads optimized for wafer level chip scale package testing. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.
Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products, announces today the release of the Volta Series probe heads optimized for wafer level chip scale package testing.
Maury Microwave Corp., a global leader in calibration, interconnect, measurement and modeling device characterization solutions, announced that John Clinton has joined the company as Director of Sales, Interconnect. With more than 30 years of industry experience, Clinton will champion the Company’s cable and connector business, building upon the year-over-year growth the company has realized since entering this market space.
Maury Microwave Corp., a global leader in calibration, interconnect, measurement and modeling device characterization solutions, announced it has signed an agreement with Hi-Tech RF & Microwave Solutions of Maarssen, the Netherlands, to act as Maury Microwave’s Master European reseller.
TE Connectivity (TE), a world leader in connectivity and sensors, announces its new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.
Samtec Inc., a leading provider of high bandwidth and micropitch interconnect systems, announced the acquisition of nMode Solutions, of Oro Valley, Ariz.
TE Connectivity (TE), a world leader in connectivity and sensors, announces its new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.