Technical Education Webinar Series

Title: Material Properties Affecting PIM in Base Station Antennas

Date: October 9, 2024

Time: 8am PT / 11am ET

Sponsored by: Rogers Corporation

Presented by: John Coonrod, Technical Marketing Manager, Rogers Corporation

Abstract:
Mobile operators have long been concerned with the measurement and mitigation of passive intermodulation (PIM). Depending on the technology being deployed, for example FDD vs TDD systems, sensitivity to PIM may vary. But PIM levels on antenna PCBs can need to be as low as -163dBc or better, which places strict demands on the materials being used, PCB fabrication, and the measurement systems employed to quantify PIM.

This presentation will review:

• A basic overview of PIM
• Different test methods and parameters for measuring PIM
• The impact on PIM of antenna designs, dielectric materials, copper foils and PCB fabrication processes
• Examples of PIM levels using different materials and future developments

Presenter Bio:
John Coonrod is the Technical Marketing Manager for Rogers Corporation, Advanced Electronics Solutions Division. John has 37 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing and materials engineering. The past twenty years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.

Please Note: By registering for this webinar, the details of your profile may be used by Microwave Journal®, the presenter and the sponsors to contact you by email.