Technical Education Webinar Series

Title: PolyStrata® Delivers High-Performance QFN Package Alternative

Date: September 5, 2024

Time:  8am PT / 11am ET

Speaker: Tim Smith, Product Manager, Packages, Cubic-Nuvotronics

Sponsors: RFMW and Nuvotronics

Abstract: 

This webinar will introduce PolyStrata®, a groundbreaking technology enabling the creation of high-performance RF packages with form factors similar to traditional QFNs. By leveraging PolyStrata's® unique properties, engineers can achieve superior electrical performance, including low loss, high isolation, and excellent signal integrity, while maintaining a compact package size. This presentation will delve into the technology's underlying principles, design considerations, and real-world applications. Attendees will gain valuable insights into how PolyStrata® can address the challenges of modern RF systems and unlock new possibilities for product development.

Speaker Bio:

Tim Smith is a packaging engineer with 14 years of experience developing innovative solutions for the RF and microwave industry. He’s passionate about pushing the boundaries of packaging technology to tackle the toughest challenges in complex RF systems. He specializes in advanced packaging technologies, particularly PolyStrata®, and has extensive experience in high-frequency microelectronic assembly and design. Tim has a proven track record of delivering high-performance RF systems that meet the stringent requirements of commercial and military applications.

Today, Tim serves as the Product Manager for Packages at Cubic-Nuvotronics, where he continues to focus on leveraging PolyStrata® to deliver innovative customer solutions.

Please Note: By registering for this webinar, the details of your profile may be used by Microwave Journal®, the presenter and the sponsor to contact you by email.