We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Emerson & Cuming Microwave Products Inc. is a world leader in the development and manufacture of microwave absorbing materials, low-loss dielectrics, and electrically conductive shielding materials. They offer engineered solutions for wireless and satellite communications, military and aerospace, automotive, RFID and medical markets. Operating globally throughout Europe, the Americas, and Asia-Pacific, the company has manufacturing facilities located in Westerlo, Belgium and Randolph, Massachusetts, USA. Emerson & Cuming Microwave Products is an ISO 9001:2008 Registered manufacturer.
Laird Technologies Inc., a designer and supplier of customized performance-critical components and systems for advanced electronics and wireless products, announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de Montréal in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308.
Optical vendors like Finisar, Intel, Avanex, and JDS Uniphase are turning to Emerson & Cuming Microwave Products for high quality products and services as the rise of popularity of on-demand, opto-electronic applications continue grow.Read more
Emerson & Cuming Microwave Products’ patent pending thin isolator material, ECCOPAD®, has solved the RFID military mandate for read on metal applications.Read more
Emerson & Cuming Microwave Products has appointed Anywave Co., LTD as their exclusive sales representative and distributor in South Korea for RF/microwave products marketed under the ECCOSORB® (microwave absorber), ECCOSTOCK® (low loss dielectric sheet) and ECCOSHIELD® (shielding materials) product lines.Read more
Emerson & Cuming Microwave Products HK LTD has signed on Bow Technology Inc., which will serve as the exclusive sales rep to cover the sales and service of RFID accounts in South Korea.Read more
Emerson & Cuming Microwave Products HK Ltd. has announced the opening of its new Hong Kong operation. These expansion plans are expected to better position the company to increase its business presence in the Asia-Pacific region. The sales and administration office, managed by Brent Ng, is located at Unit...Read more
ECCOSTOCK® SH is a rigid, closed cell, polyurethane foam which remains rigid at high temperatures. ECCOSTOCK® SH may be used at a maximum service temperature of 275°F (135°C) and at 325°F (163°C) for short periods. It is primarily used as a high temperature structural member or thermal barrier in electrical/electronic applications.
ECCOSORB® MCS is a thin, flexible, magnetically loaded, silicone rubber material that is electrically non-conductive. This product is particularly suitable for cavity resonance reduction applications in the 800 MHz to 6 GHz range. It is an extremely versatile product due to its low out-gassing and UL-94 V1 fire retardant rating.
MetalTag™ Flex is constructed using our patented elastomer and a robust, yet flexible, exoskeleton. It can withstand severe outdoor conditions, wide temperature variation and more shock than most comparably sized hard-plastic tags. Perfect for applications where the substrate is not necessarily flat or uniform.
ECCOSTOCK® HiK is a series of controlled dielectric constant materials ranging from 3 to 15. Dielectric loss is low and the accuracy of the dielectric constant is less than 3%. The material does not support fungal growth per MIL-STD-810E, has low water absorption and low outgassing for space applications.
ECCOSORB® LS is a series of light-weight, flexible, dielectrically loaded, polyurethane foam materials. These foams, black in color and UL 94 HBF fire retardant rated, achieve their lossy behavior using a conductive carbon loading system. ECCOSORB® LS is not weatherproof, but can be supplied with a special coating called CERSEAL for outdoor use.
Printed circuit-board design has become quite complicated these days. One reason for this phenomenon is the increase in availability of commercial applications, many of which are wireless in nature.