Pat Hindle, MWJ Editor
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Hindle
Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.
5G photo

A Look Ahead at Articles for the First Quarter of 2019

Commercial 5G service has been formally launched in the US and Korea with the first smartphones expected before June in 2019 in both countries. 5G has certainly happened faster than expected a few years ago and should enable a year with increased activity in the IoT market. The US Defense budget is healthy in response to an increase in sophistication of the Chinese and Russian defense capabilities with solid-state technology and flexible, software driven platforms being emphasized. So we expect 2019 to be an exciting year on the editorial front with many new innovations given solid financial support in these areas and others.


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FPC1500

Measurement Instruments for the Many

Rohde & Schwarz has always been known for high end, very accurate instruments in the high frequency and high speed industry which typically translates into high cost products. Some of these high precision instruments can cost hundreds of thousands of dollars. But did you know that R&S has a portfolio of value class instruments with more than 100 products and 300 accessories? Some new introductions included the R&S®RTB2000 Oscilloscope, the R&S®RTM3000 Oscilloscope, the R&S®RTA4000 Oscilloscope, the R&S®FPC1500 Spectrum Analyzer and the R&S®HMP4040 Power Supply. From their recent release, here is a summary of the new value instrument additions they highlighted.


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5G photo

Ericsson Mobility Report Nov 2018 Summary

Ericsson has just released their Mobility Report Nov 2018 and on a global level, they predict major 5G network deployments from 2020 and by the end of 2024 estimate 1.5 billion 5G subscriptions for enhanced mobile broadband. They think this will account for close to 17 percent of all mobile subscriptions at that time. Since the report is more than 30 pages, I thought I would extra some of the overview and devices specific data important to the RF/microwave community.


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6G

Let’s Talk 6G

In June, the first 5G specification was finalized as 5G NR phase I (release 15) and next year will see the completion of phase II for the 5G NR specification. 5G started in the U.S. in Oct this year when Verizon released the first commercial 5G service with the deployment of mmWave Fixed Wireless Access service in several cities. AT&T is starting the deployment of the first standards-based 5G mobile service now and T-Mobile plans to start in the first half of 2019. Although it will be several years before 5G becomes prevalent to the consumer around the world, we have to ask what’s next.


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5G yellow brick road

What We Learned at the 5G Symposium at EDI CON USA 2018

5G mmWave is here!

With 5G mmWave technology already deploying in the US, I was glad to oversee the EDI CON USA 2018 5G Symposium in Oct that included a full afternoon of sessions including topics such as the best RF architectures for 5G, semiconductor tradeoffs for 5G mmWave devices, antenna modeling, simulation of fixed wireless access systems, design of a 28 GHz filter and silicon active antennas for mmWave applications.


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Comsol Array

Comsol 5.4 Enhances RF Capabilities

Extended Materials & RF Part Libraries, Far-Field Analysis Functions

At its annual conference, COMSOL announced the latest version of COMSOL Multiphysics Version 5.4, which in addition to two new products provides performance improvements and additional modeling tools.


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SweGaN

New Thin GaN Structure on SiC Improves RF Performance

SweGaN is a spin-off from Linköping University that recently announced a new GaN-on-SiC HEMT heterostructure, QuanFINE ™, built on the concept of a GaN−SiC hybrid material that combines the high-electron-velocity thin GaN with the high-breakdown bulk SiC. According to their web site, the structure is realized by the company’s unique hot-wall MOCVD process and shown good result in both high-frequency and power transistors. 


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