Pat Hindle, MWJ Editor
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Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

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World’s Smallest Bluetooth and Wi-Fi Solution

March 5, 2009

Patrick Hindle

0 Comments

I came across this recently launched product from World Mobile Congress as CSR has worked with Murata and released the CSR9000 which they claim is the world’s smallest Bluetooth and Wi-Fi solution and supports a long list of connectivity technologies: Bluetooth, Bluetooth low energy, Wi-Fi (IEEE 802.11abgn) and FM receive and transmit.

This is achieved by a combination of CSR’s ‘Smart Integration’ approach to silicon design as well as being as Wafer Level Chip Scale Packaging (WLCSP) technology. WLCSP achieves the smallest PCB footprint and is the packaging technology of choice for high volume, small form factor devices such as mobile handsets.

This is another example of our Feb. theme as we trend towards nano-scale SoP technology and the industry drives down size and cost. This product supports Bluetooth low energy which seems to be opening up new applications such as embedding Bluetooth in shoes, watches, etc. What applications do you envision for this new version of Bluetooth?