Thousands of people will converge on Austin, TX August 6 for NIWeek. As large as many major trade shows, NI attracts users from many industries to learn more about their products, attend technical presentations and training sessions. This year is special with the unveiling of the much anticipated new product that promises to revolutionize the test and measurement industry. It will be very interesting to find out the details about this new product, and Microwave Journal will provide exclusive coverage of the product details in the August issue which will hit the streets the week following the gathering at NIWeek.
NIWeek is an annual global conference on graphical system design that brings together more than 3,000 engineers and scientists across a spectrum of industries, from automotive to telecommunications to robotics to energy. They gather each year to learn new technology that provides competitive advantages when developing software-defined systems for measurement and control. NIWeek includes technical networking and instruction with interactive sessions by NI R&D engineers and guest lecturers; targeted industry summits; hands-on workshops; exhibitions on the latest advancements in design, research, and test; and keynote presentations from leading technology thought leaders.
Overlapping NIWeek is the annual IEEE EMC Symposium taking place in Pittsburgh, PA this year August 5-10. This is the premier EMC event of the year as people gather from around the world from many industries for this conference and exhibition. Technical presentations will cover a wide variety of topics including EMC measurements, EMI control, computational electromagnetic, signal integrity, high power electromagnetic, EMC management, electromagnetic environments, nanotechnology and the newer topics areas of low frequency EMC, transportation EMC and Smart Grid. There are also training courses for the novice to the experienced professional given by the top leaders in the field. The exhibition includes most of the companies in the EMC/EMI industry such as AR, ETS Lindgren, Aeroflex, Ansys, CST, Rohde & Schwarz, TDK, Teseq, NEC and others.
Microwave Journal editors and staff will be attending both events to cover the newest products and announcements that are released at these events. We will be discussing new products with everyone and how they will affect the industry plus our 2013 Beijing event covering RF, Microwave and High Speed Electronics, Electronic Design Innovation Conference - EDI CON. We will also include pictures and videos in our coverage. It is going to be a hot finish to the summer!