Pat Hindle, MWJ Editor
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Hindle
Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

CTIA Wireless Opens with a Bang

March 23, 2011
Of course, the biggest news at CTIA is the proposed merger of AT&T and T-Mobile. The keynote auditorium at CTIA Wireless was packed as everyone wanted to here what AT&T and T-Mobile executives had to say about their proposed $39 billion deal which would create the country’s largest wireless operator. AT&T understandably did not say much and T-Mobile was not there. But CEO Dan Hesse of Sprint expressed concern as he said there would be 79% market share in the top 2 providers so he has concerns it would stifle innovation if that much power was in the hands of two providers. That is a valid point and of course he message is that it is not a good idea.

The first day of the exhibition was busy but not overly packed and all the big players seem to be here. Lots of 4G phones and tablets but there seems to be significant activity with 3D devices which I did not expect but should have as CES was full of 3D electronics. The RF/Microwave Zone was our first priority as that is where many of the companies we cover are present. We are glad to welcome Infineon and NXP this year in addition to many other companies who have exhibited before. With Freescale also in the Zone, there is of course a major representation of high performance Doherty LDMOS amplifier technology. All are offering various configurations (symmetric, asymmetric and single package solutions). NXP and Freescale are offering a lower cost plastic package with up to 200 W of power which seemed unique. Also near the RF/Microwave Zone are the Backhaul Pavilion, M2M Zone and Test & Measurement Pavilion so we are in a perfect position. The test and measurement companies are featuring MIMO OTA and PIM testing solutions which are both very hot topics and areas of high interest. We are running the MIMO OTA Expert Forum on Thurs which will be simulcast online so anyone can attend. It will include a question and answer session after the presentations so you can even submit questions online if you are not here in Orlando.

We will have a complete show wrap up next week.
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