Last week marked the deadline for final papers to be submitted to the peer-reviewed portion (technical sessions) of the Electronic Design Innovation conference(EDI CON) coming this April in Beijing. This year's crop of papers is an excellent representation of the state of the industry in terms of systems being developed and the advances in technology that will support these systems. Radar, LTE-A, Navigation satellite, 802.11 and MIMO were among the recurring system topics submitted mostly by industry, while GaN, CMOS, SOI and SIW were among the popular technologies submitted for consideration. Overall, we added two specific modeling tracks (one for system-level and the other for EMC/High-Speed Digital) and an additional twelve hours of presentations to the first day in order to accommodate the increase in paper submissions over 2013.
The EDI CON organizers work is now in full swing as we finalize the conference schedule and group the content to best accommodate the specific interests of attending delegates and VIP guests. In the next few weeks we will be announcing details reagrding our opening plenary sessions (which will feature two sets of keynote talks), special expert panel sessions and other conference related activities. For now, here's a brief look at how the program is shaping up.
EDI CON 2014 Conference Schedule
Overview
EDI CON 2014:
3 Day peer-reviewed industry-focused technical conference
- 86 peer reviewed papers
- 30 workshops
- 5 panel sessions
- 1 Agilent Education forum
- 8 keynote talks from Industry executives, leading researchers and academics
Technical Papers
Tracks
- RF, Microwave and High-speed digital design
- RF/mW measurement and modeling
- EMC/EMI, High-speed digital measurements and modeling
- System-level measurements and modeling
- System engineering
- Commercial resources
Sessions (2-4 papers per session)
Tuesday, April 8th
- TU101 - Envelope Tracking
- TU102 - Harmonic Load-pull Techniques
- TU103 - Spectrum Management and Analysis
- TU104 - Multiple Antenna Test
Wednesday, April 9th
- WE101 - RF/MW/HSD Circuit Design I
- WE102 - RF/MW Measurement/Modeling I
- WE103 - MIMO OTA Testing
- WE104 - Global Navigation and Communication Satellite Systems
- WE105 - Materials and PCBs
- WE201 - Power Amplifier Design and Linearization techniques
- WE202 - Device modeling for PA design and stability analysis
- WE203 - E-band and mmW System-level measurements, planning and synthesis tools
- WE204 - RADAR and LTE MIMO Systems
- WE205 - Materials, PCBs and Interconnects
Thursday, April 10th
- TH101 - RF/mW passive component and antenna design
- TH102 - Noise characterization techniques
- TH103 - EMI, high-speed characterization and jitter analysis
- TH104 - RADAR, Wide bandwidth systems, MIMO--OFDM and Phase Coherence
- TH105 - MIMO wireless test and spatial channel modeling
- TH201 - Antennas and antenna array design
- TH202 - High power transistor characterization and thermal analysis
- TH203 - Signal Integrity and gigabit channel measurements
- TH204 - Radio planification, NFC, spectrum emission mask analysis and EMVCo testing
- TH205 - Commercial resources 1
Panel sessions
- GaN Panel
nsored by Richardson RFPD
- MIMO OTA Test Panel
Sponsored Spirent Communications
- EDA Design Flow Panel
Featuring Agilent Technologies, AWR, ANSYS, CST
- Aligning RF semiconductor technology to end-use applications
Featuring OMMIC, Peregrine Semiconductor, WIN Semiconductor, Freescale
- Trends in future telecommunications systems and their engineering challenges
Moderated by Guangyi Liu, Chief Research Scientist - China Mobile Research Institute
Plenary session
- Junde Song, EDI CON 2014 Chair Emeritus – Welcome Remarks
- ERPING LI, RF and Nanoelectronics Research Center, Zhejiang University
- Keming Feng, Beijing Institute of Radio Metrology and Measurement
- Message from Host Sponsor, Agilent Technology
- Corbet Rowell, China Mobile Research - 5G Cellular Challenges
- Deng Jie , ZTE
- Message from Corporate Sponsor, NI executive
- Mr. Josef Wolf, Rohde & Schwarz
Full Program available at