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The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing process of die bonding, wire bonding or vacuum reflow impacts the package design and vice versa.
PRODUCT FEATURE An Automated Assembly Tool for Precision, High Speed RF Die-attach Applications Palomar Technologies Vista, CA As telecommunications and information processing have exploded over the last 20 years, the need for extremely accurate, high yield microchip assembly solutions has shifted from a low volume aerospace and defense industry...
