We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Set to kick off on June 20, Keysight's annual vision conference for technology leaders, engineers and innovators will explore the rapidly evolving technologies reshaping how we live, work and move through the world around us.
Keysight World: Innovate, Keysight Technologies, Inc.'s annual vision conference for technology leaders, engineers and innovators, kicks off on June 20 with actionable insights into 5G, 6G, SDVs, NTNs and digital healthcare.
Through the project leadership of Keysight Technologies, the 6G-SANDBOX project signed an agreement to establish an Open Innovation Laboratory with the European Space Agency to advance the integration of satellites with terrestrial 5G and 6G networks.
Built on the Keysight PNA-X Vector Component Analyzer solution, the demonstration characterizes a Nokia PA developed for use in 6G D-Band wireless communications systems and designed to operate with a low EVM.
Keysight Technologies introduces the Keysight E5081A ENA-X, the first midrange VNA that produces fast, accurate EVM measurements and accelerates the characterization of 5G component designs by up to 50 percent.
The space technology industry is defying gravity both literally and figuratively — driving innovation that pushes into new frontiers. Keysight’s new in-depth survey of the latest trends in the industry can help you identify:
Keysight Technologies, Inc. released a new Universal Signal Processing Architecture (USPA) prototyping platform, enabling semiconductor companies to conduct complete chip prototyping and verification, pre-tapeout, in a real-time development environment.
Keysight Technologies, Inc has obtained a FiRa™ Consortium validation for its automated UWB PHY Conformance Test Tool, enabling device makers and chip designers to quickly test the physical layer conformance of their FiRa UWB-based products.
Keysight Technologies, Inc. has joined the TSMC Open Innovation Platform® (OIP) 3DFabric Alliance, which was formed recently by TSMC to accelerate 3D IC ecosystem innovation and readiness.