ARTICLES

AWR highlights software demos at IMS 2012

Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.


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AWR announces Design Forum 2012

AWR Corp. announces the AWR Design Forum (ADF) 2012 for Japan and Korea. The Japan event is scheduled for Friday, July 6, 2012 and the Korea event is scheduled for Tuesday, July 10, 2012. The call for papers for both events is now open. Visit www.awrdesignforum.com to learn more and to submit a presentation.


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