EMC/EMI (Electromagnetic Compatibility/Electromagnetic Interference) channel

Orbel solutions made possible by 3D CAD systems

The arrival of 3D CAD programs has revolutionized the way the electronics industry is able to detect areas that have static interference within product parts. Backed by today’s newest 3D software, advanced EMI/RFI shielding solutions by Orbel provide the protection required to successfully operate a piece of electronic equipment to FCC regulations.


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EDI CON USA 2016 Call for Papers

A new, industry driven conference & exhibition focusing on high-frequency and high-speed design

EDI CON USA 2016, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, is pleased to announce their Call for Papers. Authors are invited to submit technical oral session abstracts/proposals describing work in RF/microwave, EMC/EMI and high-speed digital electronic component or system-level design, modeling or testing. The EDI CON Technical Advisory Committee will review all submissions based on quality, relevance, impact and originality.


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Instec’s EMI filter approved for Space Program

Instec LLC, a designer and manufacturer of electromagnetic interference filters and radio frequency interference filters, and an affiliate of Gowanda Holdings, announces it has successfully manufactured and upscreened an EMI feed-through filter to meet the United States Department of Defense specification MIL-PRF-28861.


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IFI's solid-state microwave pulse amplifier offers outstanding RF performance

Instruments for Industry (IFI), a unit of AMETEK Compliance Test Solutions, introduced a solid-state microwave pulse power amplifier that offers outstanding RF performance. The S21-4KWP-2KWP FLEX amplifier has a frequency range of 1.0 GHz to 2.0 GHz and supplies 4 kW of pulse power up to 10 percent duty cycle with a maximum pulse width of 100 uS. This amplifier provides ample power for the most demanding pulsed test applications.


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EDI CON China and EMC Conference and Exhibition to co-locate in 2016

Horizon House Publications and China Electrotechnical Society sign partnership agreement

EDI CON China is pleased to announce that the China Electrotechnical Society’s (CES) Electromagnetic Technology Conference & Exhibition (EMC) will be co-located on the 4th floor of the China National Convention Center (CNCC) taking place 19 to 21 April, 2016 in Beijing. The combined event forms the largest microwave, EMC/EMI and high-speed digital design conference and exhibition in Beijing. 


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New near-field probe with high resolution up to 10 GHz from Langer EMV-Technik

The SX probe heads' high measurement resolution allows the developer to pinpoint RF sources of between 1 and 10 GHz on densely packed printed circuit boards or on IC pins. The handy compact pin shape of the EMC near-field probes from Langer EMV-Technik GmbH provides the developer with convenient working conditions on the respective PCB.


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Remcom announces integration of XFdtd and Optenni Lab software

Remcom announces the integration of XFdtd® Electromagnetic Simulation Software and Optenni Lab™ matching circuit optimization software. The Optenni addition enables XFdtd users to more easily generate a matching network topology and initial component values for their device. Once the topology is chosen and physically laid out on the PCB, XFdtd’s Circuit Element Optimizer completes the matching network design process by determining the optimal component values using full wave FDTD simulation, taking electromagnetic phenomena, such as coupling, into account.


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