MTT-S IMS

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Attendees of the 2016 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made in-person by visiting LPKF Laser & Electronics in booth #1423. LPKF will be presenting its latest laser PCB prototyping system, the LPKF ProtoLaser S4, for the first time in North America.

Keysight Technologies Inc. announced an E-Band Signal Analysis Reference Solution to provide low-cost millimeter wave analysis capability for applications in the 60-90 GHz range. The reference solution is based around the 10-bit ADC Infiniium S-Series oscilloscope to provide 2.5 GHz of high-fidelity, millimeter wave frequency analysis bandwidth.

Orbel Corp., designer and manufacturer of custom ;EMI/RFI shielding, photo-etched precision metal parts and stamping; and Nolato, developer of EMC and thermal management solutions made of conductive silicone rubber, will partner to present a range of products at IMS 2016. In addition to extrusions, molded components, and dispensed gaskets, products on display will include:

More than 8,600 attendees, 23 percent of whom were first-time attendees, and a record-breaking 904 exhibitor booths filled the show floor at the Phoenix Convention Center for the IEEE MTT-S 2015 International Microwave Symposium (IMS), May 17-22. IMS, the annual conference and exhibition of the IEEE Microwave Theory and Techniques Society (MTT-S), is the premier international meeting for technologists involved in all aspects of microwave theory and practice.

Skyworks Solutions Inc., an innovator of high performance analog semiconductors connecting people, places and things,unveiled a family of ceramic-based filters targeting high frequency applications. Skyworks’ newest devices are compact, offer improved power handling and support frequencies up to 7 GHz.

Keysight Technologies Inc. demonstrated the Advanced Design System (ADS) Electro-Thermal Simulator at the IEEE MTT-S International Microwave Symposium (IMS) 2015, Booth 739, Phoenix, May 17-22. The solution provides accurate, temperature aware IC simulation results by using device temperatures that take into account thermal coupling and thermal characteristics of the RFIC/MMIC component packaging.