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Menlo Micro welcomed Under Secretary of Defense for Research and Engineering Heidi Shyu to Menlo Micro’s headquarters to discuss the widespread applications of its technology and the company’s continued work with the Department of Defense (DOD).
Atomera announced the availability of an MST® solution to dramatically enhance performance of RF-SOI wafer substrates for leading-edge cellular communication products.
With its new SIPLACE CA2 hybrid placement solution, market and technology leader ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs directly into the SMT line.
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