Software EDA Channel - Press Releases, Events, and Announcements for the EDA Sector

Remcom announces unique technology for optimizing matching circuit elements

 Remcom announces a new circuit element optimizer for XFdtd® electromagnetic simulations software that optimizes matching circuits for several antennas serving multiple bands simultaneously. XFdtd’s Circuit Element Optimizer determines lumped element values based on the following goals: radiation efficiency, system efficiency, and S-parameters. This simplifies the antenna matching workflow because the circuit elements remain in the electromagnetic layout structure during optimization. 


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NI AWR Design Environment V12 pre-release now available

NI (formerly AWR Corp.), announces that NI AWR Design Environment™ V12—the first major software release in 2015—is now available as a pre-release to select customers, partners and evaluators. Previewing for the first time at International Microwave Symposium 2015 (IMS2015) at NI Booth #2431, this latest release boasts new load-pull and antenna- and radar-specific features, as well as ease-of-use improvements, speed enhancements and third-party integration flows.


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MACOM designs Ka-Band MMIC power amplifier with NI AWR Design Environment

MACOM designers used NI AWR Design Environment™ software inclusive of Microwave Office circuit design software, AXIEM 3D planar EM simulator, Analyst™ 3D FEM simulator, and APLAC harmonic balance (HB) simulator to successfully design and simulate a 4 W Ka-band PA using a 2 mil thick 0.15 um GaAs pseudomorphic high-electron mobility transistor (pHEMT) process.


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ANSYS to present info session on new 3D EM encrypted component models at IMS

ANSYS, a global leader in engineering simulation software, will host a special information session at the IEEE MTT-S  International Microwave Symposium (IMS2015) in room 102 BC of the Phoenix convention center on Thursday, May 21. The one hour session entitled, “Leveraging Protected IP with Encrypted 3D HFSS Components for Next Generation Wireless Design & Integration” will highlight a new patent pending capability for sharing high-fidelity electrical models used in high-frequency circuit and system simulations.


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