Semiconductors / Integrated Circuits

RFMD Exceeds Two Million Units in Shipments of Multi-Chip Modules For 3G Wireless Infrastructure Transceiver Applications

RF Micro Devices Inc. announced that RFMD® has surpassed two million units in cumulative shipments of its Multi-Chip Modules (MCMs) supporting 3G base station transceiver (BST) applications for the wireless infrastructure end market. Bob Van Buskirk, president of RFMD's Multi-Market Products Group (MPG), said, "The shipment of over two...
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Cobham to Exhibit, Present at IMS 2011

Cobham will exhibit at, and conduct a number of presentations during, the upcoming International Microwave Symposium for 2011 (IMS 2011), 7-10 June 2011 at the Baltimore Convention Center, MD. As part of the IMS 2011 official program, Cobham will present a briefing on the company’s monolithic microwave integrated circuits...
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