RF & Microwave Industry News

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Fairview Microwave Inc., a preeminent supplier of on-demand microwave and RF components, announced the release of an innovative RF torque wrench reference guide designed to assist engineers select the proper tool for their application.

Comtech Telecommunications Corp. announced that its Melville, New York-based subsidiary, Comtech PST Corp., received a $1.4 million order for broadband, solid-state, high-power RF microwave amplifier systems from an international OEM.

LONGBOW LLC, a joint venture between Lockheed Martin and Northrop Grumman, received a $92.8 million contract from the U. S. Army to provide Life Cycle Contractor Support (LCCS) for LONGBOW programs on the AH-64D and AH-64E helicopters.

Peregrine Semiconductor Corp., founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. This partnership unites Peregrine’s 25 years of RF SOI experience with a tier-one foundry.

Marking a further milestone during a period of dynamic growth, Microlease, the leading global test equipment management organization, has announced the appointment of Michael E. Clark as its new chief executive officer for the Americas.

General Dynamics Bath Iron Works successfully launched the Navy's first Zumwalt-class destroyer Oct. 28 at its Bath, Maine shipyard. 

The smart home appliance market, defined by products with built-in connectivity, will witness substantial growth over the next five years, reaching nearly $25 billion by 2018. Currently limited to the top-end luxury models, wireless connectivity will slowly permeate to lower tier brands and models.

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

AVX Corp. announces the availability of new Modelithics models for its 0402 tight tolerance, high current, and high Q multilayer organic (MLO) inductor series. The latest additions to AVX’s Modelithics Component Model Library are part-value sensitive, substrate scalable, and fully integrated with a range of software applications.

Michael Casper, president and CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that they have developed a high density (HD) thin film based ENEPIG process that now combines low cost sputtering, traditional thin film photolithography and etching, and plating with ENEPIG.