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The Samsung Galaxy Appeal is one of the first mass produced phones to ship with a high performance 3G CMOS power amplifier (PA).  Despite an historical presence from CMOSin the 2G handset market concerns over performance have severely limited its progress in the 3G domain.

Sapphire CMOS technology, SMT packaging of microwave ICs and envelope tracking techniques were just some of the highlights of the November ARMMS conference.

Vishay Intertechnology Inc. announced a new Power Metal Strip® battery shunt resistor featuring a molded enclosure with a four-pin connector. Providing easy PCB connection to the shunt resistor assembly, the WSBM8518 allows design engineers to focus on circuit development instead of PCB connection issues. 

Fujitsu Semiconductor Europe(FSEU) and MSC Vertriebs GmbH have signed a pan-European distribution agreement.

The NGMN Board has welcomed the launch of the second LTE Patent Pool managed by SISVEL and combining the patent portfolios of another seven companies.

Cassidian has developed a new generation of transmit and receive modules which give the new Active Electronically Scanned Array (AESA) radars previously unattained performance, the company claims.

CTS Corp. announced the appointment of Kieran O'Sullivan to the position of president and chief executive officer effective January 7, 2013. Mr. O'Sullivan will succeed Vinod M. Khilnani, current chairman and CEO, who will remain on the board of directors of the corporation and continue to serve as executive chairman until the Annual Shareholders Meeting in 2013 and retire from CTS Corp. on December 31, 2013.

ABI Research forecasts that a total of 1.95 billion NFC-enabled devices will ship in 2017 — a combination of both handsets and CE Devices. The lion’s share of NFC enablement will continue to be focused in the handset market, although we are expecting a surge of NFC functionality included within CE devices, for simple pairing of devices, exchange of data, and online authentication functionality. In total, 395 million CE devices will ship in 2017, predominantly into media tablets, PC accessories, and gaming consoles.

The Lockheed Martin team developing the U.S. Air Force’s next generation Global Positioning System III satellites has completed thermal vacuum testing for the Navigation Payload Element (NPE) of the GPS III Non-Flight Satellite Testbed (GNST). 

TT electronics announced the expansion of its North American operations in Mexicali, Mexico with a new state-of-the-art production facility for the company’s portfolio of variable and passive components serving the defense, aerospace, medical, transportation, energy and industrial electronics markets.