RF & Microwave Industry News

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CTS Electronic Components Inc. announces development of Model 144, an oven controlled crystal oscillators (OCXOs), which uses the unique internal heated resonator (IHR) technologies to significantly reduce power consumption while maintaining excellent performance.

Northrop Grumman Corp. and the U.S. Navy have conducted the first fly-in arrested landing of the X-47B Unmanned Combat Air System (UCAS) demonstrator.

Richardson RFPD Inc. announces availability of the latest Silicon Carbide (SiC) power MOSFET from Cree Inc. (Cree). The second-generation SiC Z-FET™ 1200V MOSFET C2M0080120D delivers industry-leading power density and switching efficiency, at half the cost-per-amp of Cree’s previous-generation MOSFETs.

The selection of Metrigraphics LLC as a second source for a tiny sensor substrate has bloomed into big business, with deliveries of the micro flex circuit surpassing 14 million units this month.  Metrigraphics works with designers and engineers to take their designs and fabricate them at rapid rates. 

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.

Agilent Technologies Inc. announced enhancements to its N5973A Interactive Functional Test Automation for Verizon Wireless Compliance Test Plans software, including new scripts to automate Verizon's IMS voice-over-IP compliance test plan.

Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced availability of the industry’s highest-isolation SPDT RF switch for the wireless infrastructure market. The UltraCMOS® based PE42420 RF switch has high isolation of 64 dB @ 4 GHz — an approximately 20% increase over competing devices on the market.* Additionally, the switch features HaRP™ technology enhancements to deliver high linearity, with an IIP3 of 65 dBm.

Premix, the leading specialist in conductive plastics, launches the PREPERM® product family with customizable dielectric properties for high-frequency applications. The new product range provides high-frequency device manufacturers with an outstanding material that maximizes performance without increasing overall costs. PREPERM grades can be cost-effectively injection molded to high frequency antenna parts.

Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced in collaboration with Delft University of Technology the entanglement of electron spin qubits (quantum bits) in two synthetic diamonds separated in space. This breakthrough is a major step toward achieving a diamond-based quantum network, quantum repeaters and long-distance teleportation — changing the way information is processed and enabling new systems to efficiently tackle problems inaccessible by today’s information networks and computers.